MIMOWA - MIMO technologies for Wireless Access

logos_mimowa
Start: 01 January 2007
End: 30 June 2009
Funding: European
Status: Due
Division: Communication Systems, Communication Technologies
Department: Array and Multi-Sensor Processing (A&MSP), Physical-layer Implementation of High Performance Communication Systems (PHYCOM)
Code: Project number: PROFIT FIT-330225-2007-2, TSI-020400-2008-150, TSI-020400-2009-44

Project co-funded by the Spanish Ministry of Industry, Tourism and Commerce under the “Plan Nacional de Investigación Científica, Desarrollo e Innovación Tecnológica 2004-2007 y 2008-2011 (programas PROFIT y AVANZA I+D, Acción Estratégica de Telecomunicaciones y Sociedad de la Información)” and the “Fondo Europeo de Desarrollo Regional (FEDER)”.

The project MIMOWA belongs to the Medea+ European program (project code 2A103). It aims at simulating, implementing, validating and evaluating wireless multiple antenna MIMO (Multiple Input Multiple Output) building blocks (IP, Silicon and FPGA content) for Cellular 3G (Long Term Evolution), WiMAX (Fixed and mobile) and WiFi air interfaces. The project aims at three-fold, to explain the advantages of MIMO to a broad public, to perform state of the art analysis of the real MIMO advantages, and also to anticipate future design challenges.

The project will start with MIMO systems simulations, focus on the design and implementation of these building blocks and finish by validating and demonstrating the implementations. These demonstrations will have two-fold ambitions, to explain the advantages of MIMO to a broad public but also to perform state of the art analysis of the real MIMO advantages. Finally, a great care is taken in order to also anticipate future design challenges by having a work package focusing on the long-term MIMO evolutions.

MIMOWA will enhance European knowledge on MIMO system implementation. As this topic is and will become more and more important in wireless communications, MIMOWA will contribute to the strengthening of the European industry leadership. Other foreseeable impact will be a reduction of the development cost for network and chips resulting in  lowering final usage cost for the user and enriching academic knowledge and the skills of the workforce, and improving competitiveness in the knowledge based economy.

The overall project represents a total effort of 156 Person Year spread over 30 months. The consortium is composed of leading companies from Belgium, Germany, Spain, Israel and Turkey. The companies are active in different market segments such as: UE chipset makers, infrastructure equipment makers, operators and test equipment manufacturers. The consortium will be supported by leading research centres in order to achieve the ambitious R&D goals set in MIMOWA.

The list of partners are:

  • Agilent Technologies (Belgium)
  • OMP (Belgium)
  • STMicroelectronics (Belgium)
  • Université Catholique de Louvain (Belgium)
  • Telefónica I+D (Spain)
  • Centre Tecnològic de Telecomunicacions de Catalunya (Spain)
  • Universitat Politècnica de Catalunya (Spain)
  • Alcatel-Lucent (Germany)
  • Infineon (Germany)
  • AWE (Germany)
  • Cologne University of Applied Sciences (Germany)
  • Runcom (Israel)
  • STMicroelectronics (Turkey)

 

Contact information for the Spanish partners:

 

Telefónica I+D

Telefónica

Ignacio Berberana – ibfm@tid.es

 

Centre Tecnològic de Telecomunicacions de Catalunya (CTTC)

Universitat Politècnica de Catalunya (UPC), subcontracted by CTTC

CTTCUPC

Ana Isabel Pérez Neira – Ana Pérez mail

Antonio Pascual Iserte – Toni Pascual mail